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步步高新機採用聯發科四核心晶片

Aug 22nd 2013, 14:01

中國大陸前八大品牌廠之一的步步高今天在北京正式發表最薄智慧型手機vivo X3，採用聯發科（2454）四核心晶片「MT6589」（指晶片代號），預定9月1日正式上市。

步步高這次發表的5吋新機vivo X3機身厚度只有5.75毫米，比華為在6月份發表的手機Ascend P6薄了0.43毫米，且仍舊主打Hi-Fi音質，售價人民幣2,498元。

由於步步高近年經營中高階智慧型手機市場有成，銷售量維持不錯的狀態。法人認為，當步步高新機銷售佳，晶片供應商聯發科將會受惠。

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